Ultrasound imaging device
Non-destructive defect inspection equipment for MEMS devices. From evaluation of bonding interfaces in prototypes to full inspection of mass-produced items.
The "Ultrasonic Imaging Device" is a non-destructive defect inspection device for MEMS devices. Hitachi High-Tech can accommodate everything from the "FineSAT series" for development, prototyping, and small-scale production to the "Wafer LINE" for fully automated wafer inspection. We offer proposals that match your situation with a wide range of options. 【Features】 ■ A 64-bit processing system with enhanced analysis capabilities Capable of measuring up to 400 million points in standard specifications and up to 2 billion points in optional specifications ■ A high-speed scanner with a maximum scanning speed of 2,000 mm/sec, Significantly reduces measurement time by adopting a new ultrasonic pulser ■ Newly developed high-frequency probes (400 MHz) that accommodate various wafers with a rich lineup of probes for both short and long focal distances *For more details, please refer to the PDF materials or feel free to contact us.
- Company：日立ハイテク
- Price：Other
